TTM Technologies Inc. Registered Shares DL -,001

WKN 940990 ISIN US87305R1095

Quote/Chart

  • Bid

    16.1

    2,000 Units

  • Ask

    16.4

    365 Units

  • Change compared with previous day (price)

    -0.20 / -1.23 %

  • Spread (Act/ Rel)

    0.300 / 1.863 %

  • Today's high (Price)

    16.1

  • Today's low (Price)

    16.1

Facts & figures

Price data

Trade platform Börse Stuttgart (XSTU)  
Last price 16.1 G 0 Units
Price determination time 05/07/2024 / 08:01:31 AM
Daily volume (units) 0
Daily high / low 16.1 16.1
Prev. day's price 16.3 (06.05.)
Change day before -0.20 -1.23 %
52 week high / low 16.3 (06/05) 10.3 (08/05)

Key Figures (in EUR)

2023 2022 2021
Earnings per share -0.17 0.87 0.43
Dividends per share 0.00 0.00 0.00
Dividend Yield in % 0.00% 0.00% 0.00%
Dividend growth in % - - -
Price - Earnings ratio - 16.56 30.09
Price - Book ratio 1.07 1.00 1.08
Price - Sales ratio 0.73 0.63 0.73
Price - Cash Flow Ratio 8.67 5.74 9.27

Master Data

WKN
940990
ISIN
US87305R1095
Symbol
TT1
Exchange segment
Open Market
Type of financial instrument
Equity
Denomination
TTM Technologies
Index membership
-
Trading segment
-
Trading hours
08:00:00 - 22:00:00
Trading currency
Euro
Nominal currency
US Dollar
Settlement currency
Euro
Sector and industry
Technology, Semiconductor Industry
Number of shares
101.91 Mil.
Market capitalisation
1.25 Bil.

Performance overview

1W 1M 3M 6M 1Y 3Y 5Y YTD
Performance 14.79% 21.64% 25.38% 24.43% 58.25% 33.61% 48.91% 13.99%
High 16.30 16.30 16.30 16.30 16.30 17.60 17.60 16.30
Low 13.70 12.90 12.60 12.60 10.30 10.10 7.53 12.60

Company profile

TTM Technologies, Inc. engages in the manufacture and sale of printed circuit boards and backplane assemblies. It operates through the Printed Circuit Board and RF&S Components segments. The Printed Circuit Board segment consists of fifteen domestic PCB and sub-system plants, five PCB fabrication plants in China, and one in Canada. The RF&S Components segment consists of one domestic RF component plant and one RF component plant in China. The company offers products such as backplanes, system integration, chassis assemblies, integrated circuit substrates and chips, and engineering services. The company was founded on March 20, 1978 and is headquartered in Santa Ana, CA.